• Good dimension stability → Simple material composition, all EMC without glass fibers destroyed by laser drill.
• High heat dissipation →Higher thermal conductivity from EMC and copper pillar.
• Good reliability →Robust with all EMC+Cu simple structure, pass MSL1.
• Ultra Thin Package →Substrate is capable being ground.
• High density → Fine line width/space embedded traces, any shape Cu pillar with one-time-formation small vias.
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Flexibility →Single-layer and multi-layer structures are both available, odd-layer structure is doable.
