xQFN = routable Lead Frame

xQFN is a substrate-like lead frame which can provide fine pitch, routable, thin and multi-layer designs for QFN/DFN packages and keep lead frame’s high reliability and heat dissipation capability for Power, Automotive & RF requirement

       
Pre-molded
• Provide good supports for die bond pads and fingers, helps the UPH when die bonding and wire bonding


• Allow isolated pattern or disconnected pattern designs

Wettable Flank
 • Structure and Feature:

 LGA side-etch to get better solder wettability and make easier soldering inspection during SMT for automotive requirement.

       • ​Advantages

1.  Wettable flank by xQFN, no need step-cut or half-etch then Ni/Pd/Au plating after IC assembly → save the trouble and cost in IC assembly.
2.  Single and multiple layers are doable(from 1L~4L) → more flexibility, high density and routing capabilities in design.
3   Mold compound with Cu, robust for automotive high reliability requirement.