PLP
● PLP = Panel Level Package
PLP is an embedded die technology which applies PPt C2iM® technology platform to make Cu direct connection in between IC and EMC base substrate, good for high power and high reliability package requirement
● Advantage
- PPt PLP can provide the RDL on top of package, customers can have the components or package stacked on this embedded-die package, 20% performance increasing.
- Differ from conventional wire bond or flip chip solder joint IC assembly, PPt PLP applies laser vias connection to die pads and gives thick Cu(15um~60um) traces, it is suitable for high voltage, high current, high heat dissipation and high reliability applications.