ALF (Advanced Lead Frame) = Routable Lead Frame
PPt "
ALF" is a substrate-like lead frame which can provide
Fine Pitch, R
outable,
Thin and
Multi-Layer designs for QFN/DFN packages and keep lead frame’s high reliability and heat dissipation capability for
Power, Automotive & RF requirements.
Pre-molded
• Provide good supports for die bond pads and fingers, helps the UPH when die bonding and wire bonding
• Allow isolated pattern or disconnected pattern design
Wettable Flank
• Structure and Feature: LGA side-etch to get better solder wettability and make easier soldering inspection during SMT for automotive requirement.
• Advantages:
1. Wettable flank by ALF, no need step-cut or half-etch then Ni/Pd/Au plating after IC assembly → save the trouble and cost in IC assembly.
2. Single and multiple layers are doable(from 1L~4L) → more flexibility, high density and routing capabilities in design.
3. Mold compound with Cu, robust for automotive high reliability requirement.