FOPLP
● FOPLP = Fan Out Panel Level Package
PPt FOPLP is an embedded die technology which applies PPt C2iM® technology platform to make Cu direct connection in between IC and EMC base substrate, good for high power and high reliability package requirement
● Advantages:
- PPt FOPLP can provide the RDL on top of package, customers can have the components or package stacked on this embedded-die package, 20% performance increasing.
- Differ from conventional wire bond or flip chip solder joint IC assembly, PPt FOPLP applies laser vias connection to die pads and gives thick Cu (15um~60um) traces, it is suitable for high voltage, high current, high heat dissipation and high reliability applications.