PLP
● PLP = Panel Level Package
PLP is an embedded die technology which applies PPt C2iM technology platform to make Cu direct connection in between IC and EMC base substrate, good for high power and high reliability package requirement
● Advantage
- PPt PLP can provide the RDL on top of package, customers can have the components or package stacked on this embedded-die package, 20% performance increasing.
- Differ from conventional wire bond or flip chip solder joint IC assembly, PPt PLP applies laser vias connection to die pads and gives thick Cu(15um~60um) traces, it is suitable for high voltage, high current, high heat dissipation and high reliability applications.